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In the semiconductor industry, there are several packaging processes that cannot be wrapped around, that is, chip bonding, lead bonding, and flip connection technology. In particular, lead bonding and flip bonding are common.

With the continuous breakthrough of semiconductor technology, the status of semiconductor industry in China's economy has become increasingly prominent. In this ever-changing industry, how to improve production efficiency and reduce costs has become the focus of attenti…

China's semiconductor industry is developing rapidly, and the control of air cleanliness is increasingly strict. The semiconductor industry has extremely high requirements for air cleanliness, because both tiny particles and contaminants can have a significant impact on…

On December 14, 2023, the World Economic Forum (WEF) announced the latest batch of "lighthouse factories" list, and the Taiwan Nanqing Factory under the Industrial Rich Union was successfully selected to introduce a large number of AI technologies and promote a signific…

With the rapid development of China's new energy vehicles, industrial control and other fields, the market demand for IGBT, a key component, continues to be strong. Chinese companies are expanding rapidly in the IGBT sector.

The current rapid development of AI has put forward higher requirements for data processing, and advanced packaging processes are increasingly regarded as a way to achieve higher performance of chips, which is crucial in surpassing the Moore era, and advanced packaging …